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Current Trends in Computer Science and Mechanic...
297,00 CHF *
ggf. zzgl. Versand

Frontmatter -- Contents -- Preface / Wang, Shawn X. -- Introduction of keynote speakers -- Part IV: Sensors, Instrument and Measurement II -- Design of Remote Real-Time Measuring System of Temperature and Humidity based on Raspberry Pi and Java Language / Guo, Liang / Qian, Bi-fu / Lin, Gao-xiang / Pan, Ben-ren -- Design of Emotional Physiological Signal Acquisition System / Li, Da-peng / Ge, Xin-an -- EMC Effects On High-Resolution Spaceborne SAR Image / Pan, Yao-peng -- Real-time Pupil Detection based on Contour Tracking / Gu, Ke-ke -- Chip Manufacturing, Data Integration and Transmission / Guo, Ning / Liu, Yao-he / Yan, Ming-hui -- A DCT-domain-based Research and Application of the Algorithm of Digital Audio Watermark / Wei, Qing-qing / Cui, Ru-chun / Chen, Zi-chao / Li, Ya -- Detection of Placido rings fracture based on ECC image registration / Xu, Yi / Fu, Wei-wei / Chen, Shi / Dong, Yue-fang / Gu, Ke-ke / Wang, Li-ping -- Research on High-precision Calibration and Measurement Method based on Stereo Vision / Kong, Ying-qiao / Zhao, Jian-kang / Xia, Xuan / Zhu, Cheng-guang -- Comparison of Three Weak Small Moving Target Detection Methods based on Time Domain Filtering / Li, Zhong-min / Zou, Guo-wei -- Breath Sounds Detection System based on SOPC / Qin, Gong / Zhou, Jun -- A Novel Fiber-optic Sensor for the Determination of Melting Point of Solids / Zhang, Bao Kai / Tan, Chun Hua -- Method for Measuring Internal Liquid Level of Sealed Metal Container by Ultrasonic / Zhang, Bin / Wei, Yue-Juan / Liu, Wen-Yi / Yao, Zong / Zhang, Yan-Jun / Xiong, Ji-Jun -- Design of Silicon-on-Sapphire Pressure Sensor For High Temperature And High Pressure Applications / Guo, Zhan-she / Wang, Yan-shan / Huang, Man-guo / Lu, Chao / Zhang, Mei-ju / Li, Xin -- The Federated Filtering Algorithm based on the Asynchronous Multisensor System / Li, Lang-shu / Qiu, Hong-zhuan / Song, Hua / Wei, Chun-ling -- A Kind of Self-tuning Kalman Filter for the High Maneuvering Target Tracking System / Li, Heng / Wang, Shi-bing / Li, Jun / Li, Huai-min -- A Multitasking Run Time Prediction Method based on GBDT in Satellite Ground Application System / Fan, Cun-qun / Zhao, Xian-gang / Lin, Man-yun / Xie, Li-zi / Ma, You / Feng, Xiao-hu -- Unmanned Ground Vehicle Behavior Decision via Improved Bayesian Inverse Reinforcement Learning / Xing, Wen-zhi / Wang, Zhu-ping -- Analysis of the High Frequency Vibration on Radar Imaging in the Terahertz Band / Yang, Qi / Deng, Bin / Qin, Yu-liang / Wang, Hong-qiang -- Object Tracking for Satellite Video based on Kernelized Correlation Filters and Three Frame Difference / Sun, Yu-jia / Du, Bo / Wu, Chen / Han, Xian-quan -- Noise Removal and Detail Enhancement of Passive Infrared Image Pretreatment Method for Robot Vision / Li, Fan / Mo, Rui / Song, He-lun / Zhang, Yao-hui -- Failure Mechanism and Support Strategy of Deep Roadway with High Horizontal Stress and Broken Rock Masss / Zhang, Guang-chao / Gao, Yuan / Wang, Bing / Lai, Yong-hui -- Design of a Climbing Robot for Nuclear Environmental Monitoring / Huang, Xian / Qin, Yue / Liang, Jia-li / Liu, Yang -- Part V: Mechatronics and Electrical Engineering I -- The design and simulation of the new Space Release Device / He, Yu-heng / Feng, Kai / Ju, Heng / Lin, Cheng-xin -- The Adjusting Method of Box Girder Pose based on Spatial Coordinate Transformation / Zhan, Tao / Yang, Guang-you / Chen, Xue-hai / Liu, Wen-sheng -- Application of Discrete Element Method in the Analysis of Loader Shovel Loading Process / Fang, Xiao-geng / Chen, Yan-hui / Liu, Wan-feng / Luo, Xi-rong / Xie, Guo-jin -- Application of Piecewise Catenary Method in Length Calculation of Soft Busbar in Ultra-high Voltage Substation / Qin, Jian / Feng, Liang / Chen, Jun / Wan, Jian-cheng -- Calculation Method of Stiffness Matrix in Non-linear Spline Finite Element for Suspension Cable / Qin, Jian / Feng, Liang / Chen, Jun / Wan, Jian-cheng / Qiao, Liang / Ma, Yi-min -- A Load Outage Judgement Method Considering Voltage Sags / Wang, Dong-xu / Zheng, Xue / Ye, Xi / Cai, Wei / Yang, Zhi-chun -- Macro Program Application on Non-circular Curve Machining in CNC Lathe / Wei, Juan / Gui, Liang-liang / Lu, Pan -- Singular Configuration Analysis for the Structure of Hybrid Grinding and Polishing Machine / He, Qiu-wei

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD

ESD

166,00 CHF *
ggf. zzgl. Versand

With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: * Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. * Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). * Describes both conventional testing and new testing techniques for both chip and system level evaluation. * Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. * Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD Basics
141,00 CHF *
ggf. zzgl. Versand

Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: * The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology * Semiconductor manufacturing handling and auditing processing to avoid ESD failures * ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests * ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems * System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications * Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author's series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD Basics
85,00 CHF *
ggf. zzgl. Versand

Electrostatic discharge (ESD) continues to impact semiconductor manufacturing, semiconductor components and systems, as technologies scale from micro- to nano electronics. This book introduces the fundamentals of ESD, electrical overstress (EOS), electromagnetic interference (EMI), electromagnetic compatibility (EMC), and latchup, as well as provides a coherent overview of the semiconductor manufacturing environment and the final system assembly. It provides an illuminating look into the integration of ESD protection networks followed by examples in specific technologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturing issues, ESD semiconductor chip design, and system problems confronted today as well as the future of ESD phenomena and nano-technology. Look inside for extensive coverage on: The fundamentals of electrostatics, triboelectric charging, and how they relate to present day manufacturing environments of micro-electronics to nano-technology Semiconductor manufacturing handling and auditing processing to avoid ESD failures ESD, EOS, EMI, EMC, and latchup semiconductor component and system level testing to demonstrate product resilience from human body model (HBM), transmission line pulse (TLP), charged device model (CDM), human metal model (HMM), cable discharge events (CDE), to system level IEC 61000-4-2 tests ESD on-chip design and process manufacturing practices and solutions to improve ESD semiconductor chip solutions, also practical off-chip ESD protection and system level solutions to provide more robust systems System level concerns in servers, laptops, disk drives, cell phones, digital cameras, hand held devices, automobiles, and space applications Examples of ESD design for state-of-the-art technologies, including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, magnetic recording technology, micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to Product Use complements the author s series of books on ESD protection. For those new to the field, it is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic Era.

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD Basics
85,00 CHF *
ggf. zzgl. Versand

Electrostatic discharge (ESD) continues to impact semiconductormanufacturing, semiconductor components and systems, astechnologies scale from micro- to nano electronics. This bookintroduces the fundamentals of ESD, electrical overstress (EOS),electromagnetic interference (EMI), electromagnetic compatibility(EMC), and latchup, as well as provides a coherent overview of thesemiconductor manufacturing environment and the final systemassembly. It provides an illuminating look into the integration ofESD protection networks followed by examples in specifictechnologies, circuits, and chips. The text is unique in covering semiconductor chip manufacturingissues, ESD semiconductor chip design, and system problemsconfronted today as well as the future of ESD phenomena andnano-technology. Look inside for extensive coverage on: * The fundamentals of electrostatics, triboelectric charging, andhow they relate to present day manufacturing environments ofmicro-electronics to nano-technology * Semiconductor manufacturing handling and auditing processing toavoid ESD failures * ESD, EOS, EMI, EMC, and latchup semiconductor component andsystem level testing to demonstrate product resilience from humanbody model (HBM), transmission line pulse (TLP), charged devicemodel (CDM), human metal model (HMM), cable discharge events (CDE),to system level IEC 61000-4-2 tests * ESD on-chip design and process manufacturing practices andsolutions to improve ESD semiconductor chip solutions, alsopractical off-chip ESD protection and system level solutions toprovide more robust systems * System level concerns in servers, laptops, disk drives, cellphones, digital cameras, hand held devices, automobiles, and spaceapplications * Examples of ESD design for state-of-the-art technologies,including CMOS, BiCMOS, SOI, bipolar technology, high voltage CMOS(HVCMOS), RF CMOS, smart power, magnetic recording technology,micro-machines (MEMs) to nano-structures ESD Basics: From Semiconductor Manufacturing to ProductUse complements the author's series of books on ESDprotection. For those new to the field, it is an essentialreference and a useful insight into the issues that confront moderntechnology as we enter the Nano-electronic Era.

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD Testing
95,00 CHF *
ggf. zzgl. Versand

With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). Describes both conventional testing and new testing techniques for both chip and system level evaluation. Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD Testing
95,00 CHF *
ggf. zzgl. Versand

With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: * Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. * Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). * Describes both conventional testing and new testing techniques for both chip and system level evaluation. * Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. * Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.

Anbieter: Orell Fuessli CH
Stand: 20.09.2020
Zum Angebot
ESD

ESD

113,99 € *
ggf. zzgl. Versand

With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: * Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. * Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). * Describes both conventional testing and new testing techniques for both chip and system level evaluation. * Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. * Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work.

Anbieter: Thalia AT
Stand: 20.09.2020
Zum Angebot
Current Trends in Computer Science and Mechanic...
211,99 € *
ggf. zzgl. Versand

Frontmatter -- Contents -- Preface / Wang, Shawn X. -- Introduction of keynote speakers -- Part IV: Sensors, Instrument and Measurement II -- Design of Remote Real-Time Measuring System of Temperature and Humidity based on Raspberry Pi and Java Language / Guo, Liang / Qian, Bi-fu / Lin, Gao-xiang / Pan, Ben-ren -- Design of Emotional Physiological Signal Acquisition System / Li, Da-peng / Ge, Xin-an -- EMC Effects On High-Resolution Spaceborne SAR Image / Pan, Yao-peng -- Real-time Pupil Detection based on Contour Tracking / Gu, Ke-ke -- Chip Manufacturing, Data Integration and Transmission / Guo, Ning / Liu, Yao-he / Yan, Ming-hui -- A DCT-domain-based Research and Application of the Algorithm of Digital Audio Watermark / Wei, Qing-qing / Cui, Ru-chun / Chen, Zi-chao / Li, Ya -- Detection of Placido rings fracture based on ECC image registration / Xu, Yi / Fu, Wei-wei / Chen, Shi / Dong, Yue-fang / Gu, Ke-ke / Wang, Li-ping -- Research on High-precision Calibration and Measurement Method based on Stereo Vision / Kong, Ying-qiao / Zhao, Jian-kang / Xia, Xuan / Zhu, Cheng-guang -- Comparison of Three Weak Small Moving Target Detection Methods based on Time Domain Filtering / Li, Zhong-min / Zou, Guo-wei -- Breath Sounds Detection System based on SOPC / Qin, Gong / Zhou, Jun -- A Novel Fiber-optic Sensor for the Determination of Melting Point of Solids / Zhang, Bao Kai / Tan, Chun Hua -- Method for Measuring Internal Liquid Level of Sealed Metal Container by Ultrasonic / Zhang, Bin / Wei, Yue-Juan / Liu, Wen-Yi / Yao, Zong / Zhang, Yan-Jun / Xiong, Ji-Jun -- Design of Silicon-on-Sapphire Pressure Sensor For High Temperature And High Pressure Applications / Guo, Zhan-she / Wang, Yan-shan / Huang, Man-guo / Lu, Chao / Zhang, Mei-ju / Li, Xin -- The Federated Filtering Algorithm based on the Asynchronous Multisensor System / Li, Lang-shu / Qiu, Hong-zhuan / Song, Hua / Wei, Chun-ling -- A Kind of Self-tuning Kalman Filter for the High Maneuvering Target Tracking System / Li, Heng / Wang, Shi-bing / Li, Jun / Li, Huai-min -- A Multitasking Run Time Prediction Method based on GBDT in Satellite Ground Application System / Fan, Cun-qun / Zhao, Xian-gang / Lin, Man-yun / Xie, Li-zi / Ma, You / Feng, Xiao-hu -- Unmanned Ground Vehicle Behavior Decision via Improved Bayesian Inverse Reinforcement Learning / Xing, Wen-zhi / Wang, Zhu-ping -- Analysis of the High Frequency Vibration on Radar Imaging in the Terahertz Band / Yang, Qi / Deng, Bin / Qin, Yu-liang / Wang, Hong-qiang -- Object Tracking for Satellite Video based on Kernelized Correlation Filters and Three Frame Difference / Sun, Yu-jia / Du, Bo / Wu, Chen / Han, Xian-quan -- Noise Removal and Detail Enhancement of Passive Infrared Image Pretreatment Method for Robot Vision / Li, Fan / Mo, Rui / Song, He-lun / Zhang, Yao-hui -- Failure Mechanism and Support Strategy of Deep Roadway with High Horizontal Stress and Broken Rock Masss / Zhang, Guang-chao / Gao, Yuan / Wang, Bing / Lai, Yong-hui -- Design of a Climbing Robot for Nuclear Environmental Monitoring / Huang, Xian / Qin, Yue / Liang, Jia-li / Liu, Yang -- Part V: Mechatronics and Electrical Engineering I -- The design and simulation of the new Space Release Device / He, Yu-heng / Feng, Kai / Ju, Heng / Lin, Cheng-xin -- The Adjusting Method of Box Girder Pose based on Spatial Coordinate Transformation / Zhan, Tao / Yang, Guang-you / Chen, Xue-hai / Liu, Wen-sheng -- Application of Discrete Element Method in the Analysis of Loader Shovel Loading Process / Fang, Xiao-geng / Chen, Yan-hui / Liu, Wan-feng / Luo, Xi-rong / Xie, Guo-jin -- Application of Piecewise Catenary Method in Length Calculation of Soft Busbar in Ultra-high Voltage Substation / Qin, Jian / Feng, Liang / Chen, Jun / Wan, Jian-cheng -- Calculation Method of Stiffness Matrix in Non-linear Spline Finite Element for Suspension Cable / Qin, Jian / Feng, Liang / Chen, Jun / Wan, Jian-cheng / Qiao, Liang / Ma, Yi-min -- A Load Outage Judgement Method Considering Voltage Sags / Wang, Dong-xu / Zheng, Xue / Ye, Xi / Cai, Wei / Yang, Zhi-chun -- Macro Program Application on Non-circular Curve Machining in CNC Lathe / Wei, Juan / Gui, Liang-liang / Lu, Pan -- Singular Configuration Analysis for the Structure of Hybrid Grinding and Polishing Machine / He, Qiu-wei

Anbieter: Thalia AT
Stand: 20.09.2020
Zum Angebot